Rate controlling processes in creep of close packed metals at intermediate and high temperatures

New microstructural rate controlling models for high temperature deformation are suggested which are in satisfactory agreement not only with activation parameter values but also with various metallographic observations. Non-compact slip in the HCP and FCC structures can be described by a kink pair mechanism. This process could control dislocation glide through subgrains, and therefore the creep rate, for the cases of Mg at intermediate temperatures and FCC metals in some ranges of the high temperature domain. Recent data on cross slip show that it could be rate controlling in Cu at intermediate temperatures. In a similar temperature range, dislocation emission out of subboundaries plays an important role in Al. Revue Phys. Appl. 23 (1988) 461-473 AVRIL 1988, Classification Physics Abstracts 62.20H